Amid the ongoing technology race, China is increasing diplomatic pressure on the United States. On August 10, 2025, the Financial Times reported that Beijing has officially called on Washington to ease export restrictions on a key component for the production of AI accelerators: high-bandwidth memory (HBM). This issue has become central to the new round of trade negotiations preceding a possible meeting between the leaders of the two countries. HBM chips are a bottleneck for Chinese companies seeking to create their own powerful AI systems, and current restrictions are severely hindering their development. This call demonstrates Chinas critical dependence on foreign technology in this area and is an attempt to use trade negotiations to solve a strategic technological problem.
China Urges US to Ease Export Restrictions on HBM Chips for AI
