Samsung Electronics issued an official statement on January 2, 2026, regarding the high competitiveness of its HBM4 (4th Generation High Bandwidth Memory). According to Reuters, key clients have already completed testing initial batches and confirmed the performance boost required for training multi-trillion parameter models. HBM4 will serve as the hardware "backbone" for 2026 AI infrastructure, delivering data transfer speeds unreachable by previous standards.
This statement signals to investors that Samsung is ready to reclaim market share from its main rival, SK Hynix. The company has overcome technological packaging challenges and is prepared for mass shipments to NVIDIA and Google data centers. Analysts emphasize that without stable HBM4 supplies, further LLM scaling would be physically impossible due to "memory wall" bandwidth limitations.
Source: ReutersSamsungHBM4MemorySemiconductorsData Centers
