Reuters Confirms: $200B Samsung-Broadcom Deal to Reshape AI Chip Market

Reuters agency has revealed the incredible financial scale of the partnership concluded between Samsung Electronics and Broadcom. On July 25, 2026, it was learned that total long-term commitments under the agreement are estimated at $200 billion.

This deal deals a direct financial blow to NVIDIA’s dominance. Broadcom designs specialized custom chips (ASICs) for the planet’s largest hyperscalers, while Samsung provides the entire manufacturing loop—from silicon wafers to HBM3e/HBM4 memory stacks. $200 billion serves as a guaranteed shield against silicon shortage risks. For Wall Street, this is a sign that Big Tech has begun a mass migration from universal GPUs to custom ASICs, lowering inference costs and altering the balance of power in the semiconductor market.

Source: Reuters / Samsung Electronics