Semiconductor Bottleneck: Besi Chip Assembler Orders Surge 104%

The main beneficiary of the AI supercycle isn’t just those who design the architecture, but those who physically glue the chips together. On April 23, 2026, Dutch equipment manufacturer BE Semiconductor Industries (Besi) reported a 104.5% year-over-year surge in orders.

The secret to this jump is simple. Heavy AI computations require a dense packaging of memory and logic. The company directly points to the frenzied demand for 2.5D packaging systems (AI computing applications) and hybrid bonding. This perfectly synchronizes with yesterday’s announcement from SK hynix regarding a $13 billion investment in an HBM memory packaging plant. The market has hit the physical limit of traditional die assembly, and companies like Besi are now dictating the rules of the game in unclogging this bottleneck.

Source: Besi / Reuters