Silicon Flexibility: MediaTek Bets on Advanced Packaging from TSMC and Intel

The bottleneck in the AI industry has definitively shifted from chip printing to their physical assembly. On May 29, 2026, Taiwanese giant MediaTek confirmed the aggressive expansion of its custom AI chip business (custom neural processors for data centers).

The key announcement was a diversification strategy: MediaTek will support `advanced packaging` technologies (complex 3D assembly) from both TSMC and Intel Foundry simultaneously. In a time when Moore's Law is faltering (as Huawei explicitly stated yesterday), server power is being increased by gluing various memory and logic modules into a single die (chiplets). By rejecting an exclusive tie to TSMC's assembly lines and connecting Intel's capacities, MediaTek is hedging the risks of a global hardware shortage. This flexibility is critically important for hyperscalers who are desperately seeking alternatives to NVIDIA's monopoly solutions.

Source: MediaTek / Reuters