Blow to TSMC Monopoly: Samsung and Broadcom Sign HBM Memory and Foundry Deal

The battle for the custom AI accelerator (ASIC) market is drawing the largest vendors into unified production chains. On July 25, 2026, Samsung Electronics and Broadcom announced the signing of an MOU for strategic collaboration across HBM memory, chip contract foundry, and advanced 3D packaging.

The deal aims to create a critical link for next-generation AI infrastructure. Broadcom, the primary custom accelerator developer for Big Tech (including Google and Meta), will utilize Samsung's 2nm process node and packaging lines. For the Korean giant, this is a chance to claim revenge against TSMC in the contract chip manufacturing segment. Combining Samsung's HBM memory with Broadcom's architecture will lower the cost of ASIC chips, accelerating hyperscalers' pivot away from ultra-expensive NVIDIA solutions.

Source: Samsung Semiconductor / Broadcom / Reuters